Lean and Clean

"Lean and clean"

The Economist, March 1, 2001

Synopsis:

The case in chapter 8 provides an overview of the Japanese semiconductor industry since the 1970s up to the late 1990s. Focusing on Nippon Foundry, this article explains the current status of the Japanese semiconductor industry. Nippon Foundry boasts its world-class plant equipped with automation that cuts labor costs and reduces chip defects. The production techniques of its new parent, United Microelectronics Corporation (UMC), also enable Nippon Foundry to be more efficient in terms of production cost compared to other Japanese firms such as Toshiba, Hitachi and NEC. Introducing the expansion plan of the firm's president, this article also explains how the Japanese semiconductor industry can be restructured in the future.

Full-text Article:

http://www.economist.com/business/displayStory.cfm?Story_ID=518824&CFID=467262&CFTOKEN=6567573

Case connection:

"The Rise and Fall of the Japanese Semiconductor Industry, 1970-2000" in Chapter 8 (pp.270-273).



"Lean and clean" The Economist, March 1, 2001 Synopsis: The case in chapter 8 provides an overview of the Japanese semiconductor industry since the 1970s up to the late 1990s. Focusing on Nippon Foundry, this article explains the current status of the Japanese semiconductor industry. Nippon Foundry boasts its world-class plant equipped with automation that cuts labor costs and reduces chip defects. The production techniques of its new parent, United Microelectronics Corporation (UMC), also enable Nippon Foundry to be more efficient in terms of production cost compared to other Japanese firms such as Toshiba, Hitachi and NEC. Introducing the expansion plan of the firm's president, this article also explains how the Japanese semiconductor industry can be restructured in the future. Full-text Article: http://www.economist.com/business/displayStory.cfm?Story_ID=518824&CFID=467262&CFTOKEN=6567573 Case connection: "The Rise and Fall of the Japanese Semiconductor Industry, 1970-2000" in Chapter 8 (pp.270-273).